• Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin
  • Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin
  • Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin
  • Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin
  • Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin
  • Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin

Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin

Formula: C5h8o2
Color: Transparent
Appearance: Liquid
Main Raw Material: Acrylic
Level: Mounting
Method: Mounting
Customization:
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Company Profile
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
TJ2568 EPOXY SLOW
Certification
ISO14001, ISO9001
Components
Acrylic
Expiration Date
3 Years
Application
Metallographic Cold Mounting
Mixing Ratio (by Weight)
4.5:1 (Resin:Curing Agent) *
Mixed Viscosity
300 Cp
Curing Time (22-25 Centigrade)
45-90minutes*
Operation Time
5-10min
Peak Temperature
125 Centigrade*
Hardness
82shore D
Chemical Properties
Insoluble in Water (After Curing)
Contractility
0.00012%
Transport Package
Bucket or Customized
Specification
230g/1kg/4.5kg
Trademark
Trojan
Origin
China
Production Capacity
5000kg/Year

Product Description

Product Description

Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin
TJ2568 metallographic epoxy resin slow
This epoxy resin is a special fast-curing cold mounting material, which consists of two components--resin and curing agent, both 
in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), it can be cured into transparent hard material after 45~90minutes and the material can be polished and grinded. The material can meet the requirements of mounting various inorganic material samples. It has the advantages of good edge protection performance, good adhesion and very low shrinkage. It is suitable for microsection curing glue in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.

Product Parameters

Mixing ratio (by weight) 4.5:1 (Resin:Curing agent) *
Mixed viscosity 300 cP
Curing time (22-25ºC) 45-90minutes*
Operation time 5-10min
Peak temperature 125ºC*
Hardness 82Shore D
Chemical properties Insoluble in water (after curing)
Solubility after solidification Soluble in Trojan's special epoxy resin dissolver
Contractility 0.00012%
Vitrification temperature 55-75ºC
Edge Protection Excellent
Refractive index of light 1.519

* The above data is 30mm in diameter, 20mm in height, tested at 25°C

Certifications

Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin

Company Profile

Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting ResinMetallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting ResinMetallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting ResinMetallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin

Packaging & Shipping

Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin
Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin
Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin

FAQ

Metallographic Epoxy Resin Cold Mounting Metallographic Cold Mounting Resin

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Diamond Member Since 2017

Suppliers with verified business licenses

Rating: 3.0/5
Manufacturer/Factory & Trading Company
Management System Certification
ISO9001:2015, ISO14001:2015