Ao-P De-Agglomerated Alumina Polishing Powder
|FOB Price:||US $20-21 / Piece|
|Min. Order:||1 Piece|
|Min. Order||FOB Price|
|1 Piece||US $20-21/ Piece|
|Payment Terms:||L/C, T/T|
- Model NO.: 42210
- Type: Amphiprotic Solvent
The diamond particles were selected as the raw materials, and the morphology of the diamond particles was spherical with eight spheres;
The surface of diamond powder was modified by special technology, and the raw materials all met the requirements of environmental protection, no CFC material, non-toxic, not easy to burn water based material, not harmful to human body;
Can meet the needs of different polishing samples, not only applies to the metallurgical and lithofacies of grinding and polishing, grinding and polishing of smooth surface is also applicable to all kinds of ferrous and non-ferrous metals, ceramics, composites and gems, instrumentation, optical glass products.
Diamond polishing fluid has high efficiency of grinding and removal rate. Compared with common polishing solution, it can save more time, save time and improve production efficiency;
Cooling and lubricating group with certain dose of diamond in polishing fluid, effectively combine the key performance of grinding force and cooling, lubrication and durability of the diamond, completely reduces the possibility of heat damage of grinding and polishing process, the sample surface finish and flatness;
The utility model is convenient to use, and can be manually sprayed and added, and can also be used with various types of automatic grinding equipment.
AO-P De-agglomerated Alumina Polishing Powder
The alumina polishing powder is de-agglomerated, strict particle size distribution. Mix the powder with DI water before use.
AO-W Alumina Suspension
It is a water based stable suspension. Used for copper, tin and other soft metal or plastic material, such as PCB, SMT, semiconductor.
SO-W Silica Suspension 0.05um
Use for the final polishing.
The silica suspension provides a chemical-mechanical polishing action. It is very high concentration silica and give very fast polish rate.
Excellent for the final polish of titanium, aluminum, copper, IC etc.