Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade

Product Details
Customization: Available
Material: Diamond
Abrasive: Superabrasive
Manufacturer/Factory & Trading Company

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  • Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade
  • Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade
  • Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade
  • Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade
  • Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade
  • Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade
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  • Overview
  • Scope of application
  • Recommend for you
  • Certifications
  • Company Profile
  • Exhibition Display
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Shapes
Circle
Types
Cutting Wheel
Working Style
Cutting
CBN-M101304
100*12.7*0.4
CBN-M131304
125*12.7*0.4
CBN-M151305
150*12.7*0.5
CBN-M181308
180*12.7*0.8
CBN-M202210
200*22.0*1.0
CBN-M253215
250*32.0*1.5
CBN-M303220
300*32.0*2.0
Transport Package
Wooden Case or Customized
Specification
1pc/pkg
Trademark
Trojan
Origin
China
Production Capacity
5000pieces/Year

Product Description


Product Description
Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering BladeLab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade
Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade
Wafering blades have very thin cut Width,are recommended for precision cutting/sectioning or When cut Width loss needs to be minimized.There are plating, resin and metal bond 3 types configurations With Diamond or CBN.
 
Application: Used for hard steel, iron, cobalt nickel and lead based alloys, most commonly
used at loWer speeds.
Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade

Scope of application

Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade

Recommend for you

Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade

Certifications

Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade

Company Profile

Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering BladeLab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering BladeLab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade

Exhibition Display

Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade

Packaging & Shipping

Lab-Grade High Concentration Diamond Plating/Diamond Resin Bond/Diamond Metal Bond Wafering Blade

FAQ

Q: I didn't use this kind of machine before, is it easy for me to operate?

A: We will send you how-to tutorials and guide video in English which can teach you how to operate the machine. We can also assist
you by E-mail, phone call, online group chat and any other ways if you still have trouble handling it.

Q: If the machine has problem in my place, how could I do?

A: We could send free parts to you in warranty period if machines have any problem under normal use.

Q: What is the price and payment terms?

A: EXW, CIF, FOB we all can accept   payment: TT/Paypal /LC/Western Union.etc

 

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