Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables

Product Details
Customization: Available
Formula: C5h8o2
Color: Transparent
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ISO9001:2015, ISO14001:2015
  • Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
  • Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
  • Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
  • Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
  • Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
  • Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Company Profile
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
TJ2562 EPOXY SLOW
Appearance
Liquid
Main Raw Material
Acrylic
Level
Mounting
Method
Mounting
Certification
ISO14001, ISO9001
Components
Acrylic
Expiration Date
3 Years
Application
Metallographic Cold Mounting
Mixed Viscosity
380 Cp
Curing Time (22-25centigrade)
4-6h*
Operation Time
10-20min @ 100g
Peak Temperature
90centigrade
Hardness
82D
Chemical Properties
Insoluble in Water (After Curing)
Contractility
0.00009%
Vitrification Temperature
55-75centigrade
Edge Protection
Excellent
Transport Package
Bucket or Customized
Specification
500g/1.5kg
Trademark
Trojan
Origin
China
Production Capacity
5000kg/Year

Product Description

Product Description

Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
TJ2562 EPOXY SLOW

This epoxy resin is a special slow curing cold mounting material, which consists of two components--resin and curing agent, both 
in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), it can be cured into transparent hard material after 10~15hours and the material can be polished and grinded. The material can meet the requirements of mounting various inorganic material samples. It has the advantages of good edge protection performance, good adhesion and very low
shrinkage. It is suitable for microsection curing glue in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.

Product Parameters

Mixing ratio (by weight) 3:1 (Resin:Curing agent) *
Mixed viscosity 300 cP
Curing time (25ºC) 10-12 h
Operation time 30-60min
Peak temperature <32ºC*
Hardness 80 Shore D
Chemical properties Insoluble in water (after curing)
Solubility after solidification Soluble in Trojan's special epoxy resin dissolver
Contractility 0.00025%
Vitrification temperature 55-75ºC
Edge Protection Better
Refractive index of light 1.519

* The above data is 30mm in diameter, 20mm in height, tested at 25°C

Certifications

Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables

Company Profile

Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting ConsumablesCold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting ConsumablesCold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting ConsumablesCold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables

Packaging & Shipping

Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables
Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables

FAQ

Cold Mounting Metallography Cold Mounting Resin Metallographic Cold Mounting Consumables

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