Precision Grinding Machine for Semiconductor

Product Details
Customization: Available
Diameter: 8 Inch
Speed of Working Disc: 0-600rpm, Stepless Speed Regulation
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  • Precision Grinding Machine for Semiconductor
  • Precision Grinding Machine for Semiconductor
  • Precision Grinding Machine for Semiconductor
  • Precision Grinding Machine for Semiconductor
  • Precision Grinding Machine for Semiconductor
  • Precision Grinding Machine for Semiconductor
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  • Overview
  • Product Description
  • Features
  • Product Parameters
  • Certifications
  • Company Profile
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Direction of Working Disc
Cw/Ccw
Power of Working Disc
750W
Factory Inspection of Working Disc
Flatness < 2um
Speed of Sample Holder
0-50rpm, Stepless Speed Regulation
Direction of Sample Holder
Cw/Ccw
Rotate
Y, Adjustable
Swing
Y, Swing Range and Speed Adjustable
Factory Inspection of Sample Holder
Perpendicularity to The Disk <2um; Parallelism <2u
Maximum Removal Capacity
20mm
Power Supply
220VAC
Panel
7-Inch Touch Screen
Wxdxh
700X430X580mm
Weight
57kg
Transport Package
Standard Case or Customized
Specification
700x430x580mm
Trademark
Trojan
Origin
China
Production Capacity
5000pieces/Year

Product Description

Product Description

Precision Grinding Machine for Semiconductor

The MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. 

Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible results by eliminating inconsistencies between users, regardless of their skill. 

Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time, or preset for unattended operation. Variable speed rotation and oscillation maximize the use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.

Features

Precision Grinding Machine for Semiconductor
Front digital indicator to display real-time material removal (sample advancement), 1 µm resolution

Dual axis, micrometer controlled angular positioning of the sample (pitch and roll): +10°/-2.5° range (0.02° increments)

Full or limited automatic sample rotation with 8 speeds

Variable sample load: 0-600 g (100 g increments)

Precision spindle that indexes the sample perpendicular to the platen, and can rotate simultaneously

Rear digital indicator to display vertical positioning (static) with zeroing function, 1 µm resolution

Cam-locking system that eliminates the need for tools and allows for precise repositioning of fixtures

Designed & manufactured by Allied in the USA

 

Product Parameters

Model                                                                      SemiPOL



Working disc
Diameter 8 inch
Speed 0-600rpm,stepless speed regulation
Direction CW/CCW
Power 750W
Factory inspection Flatness < 2um




Sample holder
Speed 0-50rpm,stepless speed regulation
Direction CW/CCW
Rotate Y, adjustable
Swing Y, Swing range and speed adjustable
Factory inspection Perpendicularity to the disk <2um; parallelism <2um
Maximum removal capacity 20mm
Electricity Power supply 220VAC
Panel 7-inch touch screen
Dimension WxDxH 700x430x580mm
Weight 57kg

Certifications

Precision Grinding Machine for Semiconductor

Company Profile

Precision Grinding Machine for SemiconductorPrecision Grinding Machine for Semiconductor

Packaging & Shipping

Precision Grinding Machine for Semiconductor
Precision Grinding Machine for Semiconductor
Precision Grinding Machine for Semiconductor

FAQ

Precision Grinding Machine for Semiconductor

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