Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation

Product Details
Customization: Available
Formula: C5h8o2
Color: Transparent
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  • Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation
  • Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation
  • Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation
  • Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Company Profile
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
TJ 2220 EPOXY FAST
Appearance
Liquid
Main Raw Material
Acrylic
Level
Mounting
Method
Mounting
Certification
ISO14001, ISO9001
Components
Acrylic
Expiration Date
3 Years
Application
Metallographic Cold Mounting
Mixed Viscosity
400cp
Curing Time (22-25ºC)
30-60min*
Operation Time
4-8min @ 100 G
Peak Temperature
144 Centigrade*
Hardness
Hardness
Chemical Properties
Insoluble in Water (After Curing)
Contractility
0.00011%
Vitrification Temperature
55-75centigrade
Edge Protection
Good
Refractive Index of Light
1.519
Transport Package
Bucket or Customized
Specification
1kg/2kg
Trademark
Trojan
Origin
China
Production Capacity
5000kg/Year

Product Description

Product Description

Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation
TJ 2220 fast curing resin

This epoxy resin is a special fast-curing cold mounting material, which consists of two components--resin and curing agent, both
in liquid state; At room temperature (25°C), mix the resin and curing agent at a ratio of 2:1 (weight ratio), and it can be cured into a colorless to light yellow transparent hard material after 30-60 minutes. It has superior adhesion, very low shrinkage and low tackiness. It can penetrate into the openings and through holes of the sample, and can maintain the edge and support of the sample to the greatest extent. It is suitable for use as a microsection curing adhesive in the electronics industry, and is suitable for cold mounting sample preparation of various micro metallographic samples.

Product Parameters

Mixing ratio (by weight) 2:1 (Resin:Curing agent) *
Mixed viscosity 400cP
Curing time (22-25ºC) 30-60min*
Operation time 4-8min @ 100 g
Peak temperature 144ºC*
Hardness 83D
Chemical properties Insoluble in water (after curing)
Solubility after solidification Soluble in Trojan's special epoxy resin dissolver
Contractility 0.00011%
Vitrification temperature 55-75ºC
Edge Protection Good
Refractive index of light 1.519

The above data is 30mm in diameter, 20mm in height, tested at 25°C
 

Certifications

Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation

Company Profile

Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen PreparationMetallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen PreparationMetallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen PreparationMetallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation

Packaging & Shipping

Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation
Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation
Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation

Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation

FAQ

Metallographic Cold Mounting Resin Metallography Experiment Metallographic Specimen Preparation

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