• Diamond Metal Bond Wafering Blade, Diamond Plating Blade Cutting Wafer, Diamond Resin Bonded Blade Wafer
  • Diamond Metal Bond Wafering Blade, Diamond Plating Blade Cutting Wafer, Diamond Resin Bonded Blade Wafer
  • Diamond Metal Bond Wafering Blade, Diamond Plating Blade Cutting Wafer, Diamond Resin Bonded Blade Wafer
  • Diamond Metal Bond Wafering Blade, Diamond Plating Blade Cutting Wafer, Diamond Resin Bonded Blade Wafer

Diamond Metal Bond Wafering Blade, Diamond Plating Blade Cutting Wafer, Diamond Resin Bonded Blade Wafer

Application: Refractory Material
Quality: Top Class
Transport Package: Standard Export Package, Wooden Case
Trademark: Trojan
Origin: Suzhou China
Samples:
US$ 1/Piece 1 Piece(Min.Order)
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Customization:

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Diamond Member Since 2017

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Rating: 3.0/5
Manufacturer/Factory & Trading Company

Basic Info.

Model NO.
TJ 1211
Production Capacity
500000 PCS/Year

Product Description


Diamond Metal Bond Wafering Blade, Diamond Plating Blade Cutting Wafer, Diamond Resin Bonded Blade Wafer
 

DP Plating blade wafer

For PCB, plastic, fiber composites resin or soft non-ferrous metals.

No. Code Spec Package
01.03.520 DP101304 100*12.7*0.4mm 1pc/pkg
01.03.525 DP131304 125*12.7*0.4mm 1pc/pkg
01.03.530 DP151305 150*12.7*0.5mm 1pc/pkg
01.03.550 DP202510 200*25.4*1.0mm 1pc/pkg
01.03.560 DP253215 250*32*1.5mm 1pc/pkg
01.03.570 DP303218 300*32*1.8mm 1pc/pkg
 

DR Diamond Resin bond wafering blades

For extremely hard ferrous metals and hard alloy, etc.
 

No. Code Spec Package
01.04.620 DR101304 100*12.7*0.4mm 1pc/pkg
01.04.625 DR131304 125*12.7*0.4mm 1pc/pkg
01.04.630 DR151305 150*12.7*0.5mm 1pc/pkg
01.04.650 DR202510 200*25.4*10mm 1pc/pkg
01.04.660 DR253215 250*32*1.5mm 1pc/pkg
01.04.670 DR303218 300*32*1.8mm 1pc/pkg
 

DM Diamond Metal bond wafering blades

For very hard or brittle materials, such as glass ceramics, stone etc.

No. Code Spec Package
01.05.720 DM101304 100*12.7*0.4mm 1pc/pkg
01.05.725 DM131304 125*12.7*0.4mm 1pc/pkg
01.05.730 DM151305 150*12.7*0.5mm 1pc/pkg
01.05.750 DM202510 200*25.4*1.0mm 1pc/pkg
01.05.760 DM253215 250*32*1.5mm 1pc/pkg
01.05.770 DM303218 300*32*1.8mm 1pc/pkg

Diamond Metal Bond Wafering Blade, Diamond Plating Blade Cutting Wafer, Diamond Resin Bonded Blade Wafer


Payment & Shiping

Diamond Metal Bond Wafering Blade, Diamond Plating Blade Cutting Wafer, Diamond Resin Bonded Blade Wafer

RFQ

1, Min. Order Quantity

1 piece is OK.

2. How about your technical team construction?

We have professional technicians team with 10 years' experience.

3, What's our warranty?

12 months

4, Ways of payment

T/T, L/C, Pay pal, Western Union

5, Ways of shipment

EXW, FOB, DHL, FedEx, or upon your requirements

6, Are you a trader or manufacture?

We are manufacturer, owns our factory in Suzhou.

7, Can you accept OEM or ODM?

Of course,Logo is also acceptable

8, What is the delivery time?

No special requirements, can be delivered within 3 days. For customized models, delivery time shall be discussed and confirmed according to order



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