Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin

Product Details
Customization: Available
Application Range: Cold Mounting Compounds
Shrinkage: Less Than 2%
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  • Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
  • Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
  • Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
  • Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
  • Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
  • Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Company Profile
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
TJ 2210 Acrylic Resin
Transmittance
More Than 93%
Brinell Hardness (Kg/mm2)
More Than 12
Impact Strength (Kg.Cm/Cm2)
More Than 5
Abrasion Resistance
Excellent
Transport Package
Bucket or Customized
Specification
1kg/800ml/2.5kh/2000ml
Trademark
Trojan
Origin
China
Production Capacity
5000kg/Year

Product Description

Product Description

Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
TJ 2210 Acrylic Resin
It is widely used in PCB,SMT and semiconductor;Curingquickly,smooth,high transparency,no air bubbles; Curing time is 8-12min(25ºC)
Acrylic resin agent is a resin glue composed of powder and liquid, that is, composed of acrylic powder and liquid curing agent.
It is composed of metallographic acrylic powder and metallographic curing agent. Mix the curing agent with acrylic powder at room
temperature (20-25ºC), and it can be cured into a transparent hard material after 10-15 minutes, and the material can be ground and
polished. It has the advantages of low heat release, small thermal shrinkage, good weather fastness and good wear resistance. It
is suitable for making permanent specimens and micro-slicing materials for circuit boards and metalworking industries.
Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
Fast curing, stable, high transparency;
Low viscosity, excellent flow properties;
Excellent permeability to small pores and depressions;
Good support for the slices after curing of the slices;
Sufficient hardness and toughness after curing;
Sufficient brightness after polishing;
Low shrinkage before and after curing ;
Suit with all currently known soft or hard plastic molds;
Low exotherm, peak temperature <73°C (20g, room temperature 20-22°C)

Product Parameters

Appearance Acrylic Powder: White powder.
Curing Agent Colorless to pale green transparent liquid.
Shrinkage ≤2%
Transmittance ≥93%
Brinell hardness (kg/mm2) ≥12
Impact strength (kg.cm/cm2) ≥5
Abrasion resistance excellent

Certifications

Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin

Company Profile

Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy ResinMetallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy ResinMetallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy ResinMetallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin

Packaging & Shipping

 

Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin

Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin
 

FAQ

Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin





 

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