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Wafering Blade for Cutting Hard Brittle Delicate Materials

Name: Wafering Blade for Cutting Hard Brittle Delicate Materials
Brand: Trojan (Suzhou) Material Technology Co., Ltd.
SKU: GyHJQqnVvhWP
Price: 30.00 USD
Availability: InStock

Wafering Blade for Cutting Hard Brittle Delicate Materials pictures & photos

Grain Size:	Medium
Application:	Machine Tool
Material:	Diamond
Structure:	With Connector
Adhesive:	Resin Adhesive
Adhesive Strength:	Hard

Customization:	Available \| Customized Request

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